Global Molded Interconnect Device (MID) Market Report 2022: $2.7 Billion Market by 2027

Global Molded Interconnect Device (MID) Market Report 2022: $2.7 Billion Market by 2027

DUBLIN, October 17, 2022 /PRNewswire/ — The “Molded Interconnect Device (MID) Market” report has been added’s offer.

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The MID market is expected to grow 1.4 billion dollars in 2022 until 2.7 billion dollars until 2027; expected to grow at a CAGR of 13.6%

The major driving factors for the growth of the MID market include the growing advancement in the automotive vertical.

Connectors and switches account for a significant market size of the molded interconnect devices (MID) market during the forecast period

Connectors and switches are mainly used in the automotive and medical industries. In the automotive Vertical, connectors are used in navigation devices, infotainment systems, cameras and so on. MID technology is used in connectors to improve assembly operability, ensure electrical and mechanical reliability and offer compactness. The problem of limited space in switches can be solved by using MID technology

Telecommunications will have the second highest CAGR during the forecast period.

In the telecommunications sector, MIDs are used in mobile phones and landlines, remote controls and global telecommunications infrastructure such as satellites, base equipment and network equipment. In general, network-based telecommunications are used in three different broad business areas, namely, central office, field facilities, and mobility.

Central office refers to large facilities where large-scale communications are switched and processed; external facilities refer to switching stations where distribution switching occurs for commercial and residential landline telephones; and the third area is mobility, where tower-based power and ground support the transmission of mobile communications.

The US will grow at the highest CAGR in North America during the forecast period.

The US is the main revenue generator for mid-sized players North America. In 2021, the US had the highest CAGR in the mid-market North Americathanks to the presence of leading manufacturers such as Molex, Arlington Plating Company, Amphenol Corporation and Kyocera AVX Corporation.

These manufacturers provide a comprehensive range of MID products to improve the electrical connectivity and performance of equipment or devices in various applications. Consumer electronics, medical, telecommunications and industrial applications are driving demand for MID devices in the US.

The US consumer electronics market continues to grow. Moreover, it has been observed that the demand for miniaturized packages has started to gain momentum in consumer electronics, automotive components, medical equipment and other devices.

The competitive landscape

The key players operating in the market are Molex (USA), LPKF Laser & Electronics (Germany), TE Connectivity (Switzerland), Taoglas (Dublin), Arlington Plating Company (USA), Amphenol Corporation (USA), MID Solutions (Germany), 2E mechatronics (Germany), KYOCERA AVX (USA) and Johnan (Japan).

Premium Insights

  • Increasing Use of Molded Interconnect Devices in the Automotive Industry to Offer Market Growth Opportunities from 2022 to 2027

  • Sensors to register the highest CAGR during the forecast period

  • The consumer electronics vertical will hold the largest share in the mid-market during the forecast period

  • Lds will hold the largest market size for LDS process during the forecast period

  • Mid-market for record highest CAGR in China in 2027

Market Dynamics


  • The increasing use of LDS in the production of 5G antennas

  • Increasing use of intermediate devices in medical devices

  • Growing demand for miniaturization in the consumer electronics industry

  • Intensification of the need to reduce e-waste




Value chain analysis

  • Research and development

  • Manufacturing

  • Assembly

  • Marketing and sales

  • End users

Technology Analysis

Company profiles

Key companies

Other important players

  • Teprosa

  • Sunway Communication

  • Axon Cable

  • S2P

  • Suzhou Cicor Technology Co., Ltd. Ltd

  • Tactotek

  • Duratech Industries

  • Tekra

  • Yomura Technologies

  • Macdermid Alpha Electronics

  • Galtronics

  • Yazaki Corporation

  • Chogori Technology

  • Suzhou Zeetek Electronics

  • Toyo connectors

  • Sinoplast

For more information on this report, visit

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SOURCE Research and Markets

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