MediaTek Dimension 9200: New flagship chipset with ARM Cortex-X3 CPU and Immortalis-G715 GPU core built around TSMC N4P node

MediaTek has removed the curtain on the company’s latest 5G chipset Dimension 9200. Billed as being designed to power the next era of flagship smartphones, the Dimension 9200 is the world’s first smartphone SoC to be equipped with an ARM Cortex X3 CPU core. Similarly, the Dimensity 9200 is powered by ARM’s Immortals-G715, a GPU that supports hardware-based ray tracing as well as Wi-Fi 7 ready connectivity.

Additionally, MediaTek claims several other firsts for the Dimension 9200 as well, such as LPDDR5X RAM running at 8533Mbps and an RGBW ISP. In addition, the Dimension 9200 relies on TSMC’s second generation 4 nm manufacturing process (N4P), as well as ARM’s second generation Armv9 architecture. For reference, MediaTek built the Dimension 9200 with the following CPU cores:

• 1x Cortex-X3 – 3.05 GHz
• 3x Cortex-A715 – 2.85 GHz
• 4x Cortex-A510 – 1.8 GHz

Reportedly, the new chipset from MediaTek delivers 12% better single-core performance compared to Geekbench 5.0. Dimension 9000, However, in multi-core work the difference is reduced to 10%. That being said, the Dimension 9200 offers 25% less power consumption under load, 10% better heat dissipation efficiencies, and up to 32% better GPU performance compared to the Manhattan 3.0. Dimension 9000 While using 41% less power to boot.

Overall, MediaTek claims that the AnTuTu v9 has a Dimension 9200 score of 1,260,000 points, which will be much higher than any current flagship score. Currently, MediaTek has only revealed that the Dimension 9200 should hit the shelves ‘by the end of 2022’. Unfortunately, it remains to be seen what smartphones the Dimensity 9200 will feature, nor how it will compare to the upcoming Snapdragon 8 Gen 2,